December 21, 2021, Shanghai, China ---The domestic EDA and filter industry leader, Core and Semiconductor Technology (Shanghai) Co., Ltd. (hereinafter referred to as "Core and Semiconductor") announced that it will be the sixteenth in 2021 just held At the "China Chip" IC Industry Promotion Conference, Chips & Semiconductors won the "China Chip" EDA Outstanding Support Service Enterprise Award.
The "China Chip" IC Industry Promotion Conference is a national integrated circuit industry event organized by the China Electronics Information Industry Development Research Institute. It is one of the most influential and authoritative industry conferences in the domestic integrated circuit field. The "China Chip" excellent product solicitation event held at the same time as the conference aims to commend the achievements in product innovation, technological innovation and application innovation in the domestic integrated circuit field, play a demonstration effect, influence and promote the development of the industry, and has become a domestic integrated circuit product and technology A weather vane and a big review of development.
As a leader in the domestic EDA industry, Core & Semiconductor has formed a complete set of simulation EDA solutions covering the entire semiconductor industry chain from chip-package to board level through 11 years of research and development. Driven by system analysis, the simulation EDA of Core and Semiconductor has opened up all simulation nodes of IC design in the post-Moore era, and fully supports advanced technology and advanced packaging.
On the advanced process side, Core and Semiconductor has passed the certification of mainstream processes in major fabs, providing the industry's top chip-on-chip modeling and simulation capabilities to ensure chip-level PPA. In 2021, Samsung, the world’s second-largest fab, announced that Core and Semiconductor has officially become its SAFE-EDA ecosystem partner. Core and Semiconductor’s on-chip passive electromagnetic field (EM) simulation kit has successfully passed Samsung’s 8nm low-level fab. Power consumption (8LPP) process technology certification.
On the advanced packaging side, the simulation analysis program of core and semiconductor extends from traditional packaging to the 2.5D/3DIC heterogeneous integrated packaging field, providing complete simulation analysis capabilities. In 2021, Sihe Semiconductor will join hands with Synopsys, the world's No. 1 EDA technology company, to release the world's first 3DIC advanced package design analysis EDA platform.
In addition, following the development direction of system integration design in the post-Moore era, while supporting advanced technology and advanced packaging, Core and Semiconductor has built an "electronic system" modeling simulation analysis EDA platform, including radio frequency system analysis platform and high-speed Digital system analysis platforms, etc., help designers improve the PPA of various electronic products from the perspective of system integration design and analysis, and shorten the product listing cycle.
These independently innovative products have quickly narrowed the gap with the international leading EDA, empowered and accelerated the design of a new generation of high-speed and high-frequency intelligent electronic products at home and abroad, and provided excellent support services to alleviate the status quo of the domestic semiconductor industry.
Dr. Wenliang Dai, co-founder and senior vice president of Chips and Semiconductors said: "We are very honored to be recognized by the "China Chips" Organizing Committee and selection experts. Chips and Semiconductors are selected as the 2021 "China Chips" EDA Outstanding Support Service Enterprise Award. .Xihe Semiconductor will continue to polish the differentiated EDA simulation solution technology, a rich ecosystem of semiconductor partners, and a series of cutting-edge technologies such as cloud computing, and launch more powerful technologies around 5G mobile communications, Internet of Things, data centers, and automotive electronics. Powerful EDA and chip solutions serve the booming development of the domestic semiconductor industry."