In the whole semiconductor industry chain, processing and manufacturing is one of the most important links. With such a huge market, semiconductor process equipment provides the manufacturing basis for semiconductor large-scale manufacturing. This paper will focus on what are the main equipment in the semiconductor production process.
1, single crystal furnace
Equipment function: melt semiconductor materials, pull single crystal, for the subsequent semiconductor device manufacturing, provide single crystal semiconductor billet.
Major international brands: PVA TePla AG (Germany), Ferrotec (Japan), QUANTUM DESIGN (USA), Gero (Germany), KAYEX (USA).
Major domestic brands: Beijing Jingyuntong, Seven Star Huaxuang, Beijing Jingyi Century, Hebei Jinglong Sunshine, Xi 'an Jinko Technology, Changzhou Huasheng Tianlong, Shanghai Hanhong, Xi 'an Huade, The 48th Institute of China Electronics Technology Group, Shanghai Shenhe Thermal Magnetic.
2. Gas phase epitaxial furnace
Equipment function: to provide specific process environment for gas phase epitaxial growth, to realize the growth of thin layer crystals with corresponding relationship with single crystal crystal phase on the single crystal, and to make basic preparation for the functional realization of single crystal sinking. Gas phase epitaxy is a special process of chemical vapor deposition, in which the crystal structure of the growth thin layer is a continuation of the single crystal substrate and corresponds to the crystal orientation of the substrate.
Major international brands: CVD Equipment, GT, Soitec, AS, Proto Flex, Kurt J.Lesker, Applied Materials.
Major domestic brands: China Electronics Technology Group 48th Institute, Qingdao Cerida, Hefei Kojing Material Technology Co., LTD., Beijing Jinsheng Micro nano, Jinan Liguan Electronic Technology Co., LTD.
3. Molecular beam epitaxy system
Equipment functions: Molecular beam epitaxy system, providing the process equipment to grow the film on the bottom surface according to the specific; Molecular beam epitaxy (MBEA) is a technique for preparing single crystal thin films. It is used to grow thin films layer by layer along the crystal axis of the substrate under appropriate substrate and suitable conditions.
Major international brands: Riber (France), Veeco (USA), DCA Instruments (Finland), SVTAssociates (USA), NBM (USA), Omicron (Germany), MBE-Komponenten (Germany), Oxford Applied (UK) Research (OAR) company.
Major domestic brands: Shenyang Zhongke Instrument co., LTD., Beijing Huidexin Technology Co., LTD., Shaoxing Kuangtai Instrument Equipment Co., LTD., Shenyang Keyou Vacuum Technology Co., LTD.
4. Oxidation furnace (VDF)
Equipment function: For semiconductor material oxidation treatment, provide the required oxidation atmosphere, to achieve the expected design of semiconductor oxidation treatment process, is an indispensable link in the semiconductor processing process.
Major international brands: UK Thermco Company, Germany Centrotherm Thermal Solutions GmbH Co.KG company.
Major domestic brands: Beijing Seven Star Huaxuang, Qingdao Freunde, China Electronics Technology Group 48th institute, Qingdao Xuguang Instrument Equipment Co., LTD., China Electronics Technology Group 45th Institute.
5. Low pressure Chemical Vapor Deposition System (LPCVD)
Equipment function: The vapor containing the gaseous or liquid reaction-agent which constitutes the elements of the film and other gases required for the reaction are introduced into the reaction chamber of the LPCVD equipment, and the film is generated by chemical reaction on the substrate surface.
Major international brands: Hitachi International Electric Company,
Major domestic brands: Shanghai Chijian Semiconductor Technology Co., LTD., China Electronics Technology Group 48th Institute, China Electronics Technology Group 45th Institute, Beijing Instrument Factory, Shanghai Machinery Factory.
6. Plasma Enhanced Chemical Vapor Deposition System (PECVD)
Equipment function: use glow discharge in the deposition chamber, make it ionize and conduct chemical reaction on the substrate to deposit semiconductor thin film material.
Major international brands: Proto Flex (USA), Tokki (Japan), Shimadsu (Japan), Lam Research (USA), ASM International (Netherlands).
Major domestic brands: China Electronics Technology Group 45th Institute, Beijing Instrument factory, Shanghai Machinery Factory.
7. Magnetron Sputtering Table (MSA)
Equipment functions: through a closed magnetic field parallel to the target surface in the bipolar sputtering, and the orthogonal electromagnetic field formed on the target surface, the secondary electron is bound to the specific area of the target surface, to achieve high ion density and high energy ionization, and the target atoms or molecules are deposited on the substrate with high rate sputtering to form a film.
Major international brands: PVD Company, Vaportech Company, AMAT Company, Hauzer Company, Teer Company, Platit company, Balzers company and Cemecon company.
Major domestic brands: Beijing Instrument Factory, Shenyang Zhongke Instrument co., LTD., Chengdu Nanguang Industrial Co., LTD., China Electronics Technology Group 48th Institute, Kerui Equipment Co., LTD., Shanghai Machinery Factory.
8. Chemical Mechanical polishing Machine (CMP)
Equipment function: through the mechanical grinding and chemical liquid dissolution "corrosion" of the combined effect, to be lapped (semiconductor) polishing.
Major international brands: Applied Materials, Norfa Systems, Rtec.
Major domestic brands: Lanzhou Lanxin High-tech Industry Co., LTD., Alite Microelectronics.
9, lithography machine
Device function: evenly glue on the surface of semiconductor substrate (silicon wafer), transfer the pattern on the mask to photoresist, and temporarily "copy" the device or circuit structure to the silicon wafer.
Major international brands: ASML (Netherlands), Pan Lin Semiconductor, Nikon, Canon, ABM, SUSS, MYCRO.
Major domestic brands: China Electronics Technology Group 48th Institute, China Electronics Technology Group 45th Institute, Shanghai Machinery Factory, Chengdu Nanguang Industrial Co., LTD.
10. Reactive Ion Etching System (RIE)
Equipment functions: the high frequency voltage is applied between the plate electrodes to produce ion layer hundreds of microns thick, and the ion high-speed impact pattern is put into the pattern, to achieve chemical reaction etching and physical impact, and to achieve semiconductor processing and molding.
Major international brands: Japan Evatech Company, the United States NANOMASTER company, Singapore REC Company, South Korea JuSung company, South Korea TES Company.
Major domestic brands: Beijing Instrument Factory, Beijing Qixing Huachuang Electronics Co., LTD., Chengdu Nanguang Industrial Co., LTD., China Electronics Technology Group forty-eighth Institute.
11. ICP plasma etching system
Equipment functions: one or more gas atoms or molecules mixed in the reaction chamber, under the action of external energy (such as radio frequency, microwave, etc.) to form a plasma, on the one hand, the active group in the plasma and the surface material to be etched chemical reaction, generating volatile products; On the other hand, the ions in the plasma are guided and accelerated under the action of bias pressure to realize directional corrosion and accelerated corrosion of the etched surface.
Major international brands: Oxford Instruments (UK), Torr (USA), Gatan (USA), Quorum (UK), Leeman (USA), Pelco (USA).
Major domestic brands: Beijing Instrument Factory, Beijing Qixing Huachuang Electronics Co., Ltd., China Electronic Technology Group 48th Institute, Goder ion Technology (Hong Kong) Holding Co., Ltd., Institute of Microelectronics, Chinese Academy of Sciences, North Microelectronics, Beijing Oriental Jicheng Co., Ltd., Beijing Trands Weina Technology.
12, wet etching and cleaning machine
Equipment function: Wet etching is the etching material soaked in etching solution for corrosion technology. Cleaning is to reduce contamination, which can affect device performance, lead to reliability problems, and reduce the yield, which requires thorough cleaning before each layer of the next process or before the next layer.
Major international brands: Screen(Japan), SEMES(Korea), Tokyo Electron (Japan), Lam Research (America).
Major domestic brands: Nantong Hualin Kona Semiconductor Equipment Co., LTD., Beijing Qixing Huaxuang Electronics Co., LTD., China Electronics Technology Group 45th Institute, Taiwan Hongsu.
13. Ion implantation Machine (IBI)
Equipment function: doping the area near the surface of the semiconductor.
Major international brands: Varian Semiconductor Equipment, Inc., CHA, INC., AMAT, Inc. and Varian Semiconductor Manufacturing Equipment, Inc. (acquired by AMAT).
Major domestic brands: Beijing Instrument Factory, China Electronics Technology Group 48th Institute, Chengdu Nanguang Industrial Co., LTD., Shenyang Fangji Light Industry Machinery Co., LTD., Shanghai Silicon Top Microelectronics Co., LTD.
14, probe test bench
Device function: Through the probe contact with the pad of the semiconductor device, electrical test is performed to check whether the performance index of the semiconductor meets the design performance requirements.
Major international brands: Germany Ingun company, QA company, MicroXact company, Ecopia company, Leeno company.
Major domestic brands: China Electronics Technology Group 45th Institute, Beijing Qixing Huachuang Electronics Co., LTD., Ruike Instruments, Huarong Group, Shenzhen Senmei Xieer Technology.
15. Wafer thinning machine
Function: reduce the thickness of wafer by polishing.
International main brands: Japan DISCO Company, Germany G&N company, Japan OKAMOTO company, Israel Camtek company.
Major domestic brands: Lanzhou Lanxin High-tech Industry Co., LTD., Shenzhen Fonda Grinding Equipment Manufacturing Co., LTD., Shenzhen Jinzhili Precision Grinding Machine Manufacturing Co., LTD., Weianda Grinding Equipment Co., LTD., Shenzhen Huannifeng Technology Co., LTD.
16. Wafer Scribing Machine (DS)
Device function: The wafer, cut into small pieces of Die.
Major international brands: Germany OEG company, Japan DISCO Company.
Major Domestic brands: China electronics technology group, Beijing kechuang by commencing source photoelectric technology co., LTD., shenyang institute of instrumentation technology, the northwest machine co., LTD., (709 factory) have the northwest machine factory, hui sheng electronic electronic machinery and equipment company, lanzhou: laser, an high-tech industry co., LTD., shenzhen ruby laser equipment co., LTD., Wu Hansan worker, zhuhai Lianoptronics, Zhuhai Yuemao Technology.
17. Wire Bonder
Device function: Connect the Pad on the semiconductor chip with the Pad on the pin with the conductive metal wire (gold wire).
Major international brands: American Ottey, German TPT, Austria FK, Malaysia UNISEM.
Major domestic brands: China Electronics Technology Group 45th Institute, Beijing Transhijie Technology Development Co., LTD., Yuxin (Chengdu) Integrated Circuit Packaging and Testing Co., LTD. (Malaysia Yunisan Investment), Shenzhen Kaijiu Automation Equipment Co., LTD.