Shanghai, China -- Chip and Semiconductor Technology (Shanghai) Co., LTD. (HEREINAFTER referred to as "CHIP and Semiconductor"), the domestic EDA industry leader, officially unveiled its Microsoft Azure based EDA cloud platform at DesignCon 2021 in SAN Jose, USA.
Driven by high performance computing applications such as 5G, artificial intelligence, autonomous driving and edge computing, the semiconductor industry is deepening technological breakthroughs in advanced process and advanced packaging, which makes the EDA process from chip to package to system design and verification more and more complex.
Highly dependent on the traditional engineering simulation including the IT infrastructure of high performance computing cluster, but as the design cycle and shorter time to market, engineering simulation analysis of the demand for high performance computing often volatile and unpredictable, based on peak demand to create IT infrastructure not only become very challenging and is not economic. Core and Semiconductor based on Microsoft Azure EDA platform can just solve these problems, to ensure the scalability and agility required by high-performance EDA simulation tasks.
Mr. Wang Shenglin, technical Director of Microsoft Greater China Omni Channel Division, said, "Core and Semiconductor provide customers with efficient EDA simulation solutions from chip to package to system by using their own intellectual property electromagnetic algorithm technology. Microsoft Azure can provide abundant computing power and elastic supply, IT infrastructure and CAD ready, plus the integration of many EDA, IP, Foundry related ecological resources. Together, they will provide chip designers with the ability to quickly respond to market demands and scale their computing resources, greatly reducing time and cost."
"We are very pleased to release the EDA Cloud platform based on Microsoft Azure," said Dr. Feng Ling, CEO of ChipChip. Core and semiconductor electromagnetic solvers support multi-core parallel and distributed parallel, which is very suitable for cloud environments. Core and its own scheduler, JobQueue, manage computing resources and prioritize simulation jobs. These advantages combined with the near unlimited resources that Microsoft Azure provides ensure the core and can help users achieve successful scale-out of simulation jobs."
Core and semiconductor EDA introduction
Founded in 2010, Chihehe semiconductor is the only supplier of "semiconductor industry chain simulation EDA solutions" in China. EDA is the preferred tool for designing high frequency/high speed electronic components in the new generation of intelligent electronic products. It includes three product lines:
The product line of chip design simulation provides precise PDK design solutions for fabs and on chip design companies with high frequency parasitic parameter extraction and modeling solutions.
Advanced packaging design simulation product line provides high speed and high frequency electromagnetic field simulation solutions for traditional packaging and advanced packaging;
The high-speed system design and simulation product line provides a simulation platform for rapid modeling and passive parameter extraction of the interconnection structure of PCB board, components and systems, and solves the problem of signal and power integrity in high-speed and high-frequency systems.
The powerful functions of core and semiconductor EDA are based on: A thriving wafer and partner ecosystem (core and semiconductor EDA are proven on advanced process nodes and advanced packages at all major fabs), and support for high-performance distributed computing technologies based on cloud platforms. It has been widely used in 5G, smartphones, the Internet of things, automotive electronics and data centers.