With the continuous development trend of today’s high-tech, electronic components are used more and more widely in high-tech industries such as airlines, aerospace, instrument panels, precision measurement, and military. In addition, the quality of electronic components is clearly higher. Provisions.
The quality of electronic components will immediately jeopardize the performance of machinery and equipment, and the electronic products composed of them must have the ability to resist corrosion by environmental factors. Therefore, many regulations require excellent sealing performance to prevent external liquid (gas and/or liquid) media from penetrating into the interior through structural gaps, voids or holes, which will bring adverse hazards to the performance of electronic components.
If the sealing performance is poor, it will not be able to withstand the erosion of environmental factors, and photosynthesis will occur in the natural environment with high temperature, environmental humidity change and harmful substances, which will cause electrolysis in the iron wire or the plated metal material layer inside the electronic device. The method is eroded and destroyed, causing the main parameters of electricity to be changed, the performance is reduced or the function is immediately lost; the actual effect of the sealing is poor, and the internal water vapor is too high. When the temperature is ultra-low temperature, it will cause the automotive relay to cause spray welding at the contact point, and then make it work. Missing; or in order to better prevent electromagnetic radiation, prevent the influence of light sources, etc., when electronic components are sealed, the sealing performance is not good, which may cause immediate invalidity, and this disadvantage will seriously harm the application of electronic components. stability. Therefore, basically all electronic component manufacturers must carry out sealing leak detection of electronic components, test the sealing performance of electronic components, and select electronic components with excellent sealing performance.
The selection of electronic components is determined by leak detection experiments, and the selection of fake sealing materials or poor processing technology causes sealing problems. Its leak detection is divided into two whole processes: fine detection and rough detection. The fine leak detection uses the back pressure method of the hydrogen mass spectrometry leak detector. At this stage, the common leak detection is the fluorine oil vapor bubble method. Experiments generally carry out fine leak detection first, and then carry out rough leak detection.
Fluorine oil has excellent electrical polarization performance, excellent organic chemical plasticity, high-quality dielectric strength and excellent resistance to high and low temperature test work. It is resistant to corrosion of electronic components and does not harm various main parameters of the device. The key to become an idealized liquid leak detection for a rough leak detection experiment includes two steps of pressing in a low-boiling fluorine oil and a high-boiling fluorine oil with heated air bubbles.
The first step is to put the clean and clean electronic components under inspection into a pressurized vessel, which is sealed and vacuum-packed, and then add low-boiling fluorine oil to the vessel under the condition of a vacuum pump to completely engulf the inspected device. Fill the vessel with N2 for a certain period of time. If the tested device has a standard orifice plate, the low-boiling fluorine oil will be pressed into the inner wall of the tested device. After charging, remove the electronic device and put it in the air for a certain period of time to remove the low-boiling fluorine oil on the surface of the electronic device under test.
The second step is to infiltrate the dry tested device into the high-boiling fluorine oil that has been heated to 125°, and the top of the tested device should not penetrate less than 5 cm into the deep layer. Immerse for a certain period of time, and observe whether there are bubbles in the electronic components under inspection with a high-power magnifying glass. If the bubbles continue to release, it indicates that there is a problem with the sealing performance of the electronic components under inspection.
Summary: With the continuous development trend of high-tech technology, its application will become more common, and the quality regulations for electronic components will become more and more stringent. Rough leak detection experiment is the only way to test the quality of electronic components. The requirements for the rough detection of electronic components are getting higher and higher, and the requirements are getting bigger and bigger.
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